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Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-V (7361-38 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST ZE series connector, BM16B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-10A1, example for new mpn: 39-29-4089, 4 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xx-DV-PE-LC, 47 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0011 example for new part number: 26-60-4120, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator TE FPC connector, 17 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4 TE FPC connector, 24 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 43 top-side contacts, 0.5mm pitch, SMT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-xf2m.pdf HDMI Type A connector, Amphenol 10029449-001TLF 10029449-001RLF 10029449-101TLF 10029449-101RLF, Right Angle(https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10029449.pdf SMD IDC box header, 2x04, 1.00mm pitch, double rows Surface mounted pin header THT 2x39 2.00mm double row Through hole angled socket strip, 1x08, 2.54mm pitch, 6mm pin length, single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x13 2.54mm single row Through hole angled pin header SMD 1x33 1.00mm single row style2 pin1 right Through hole pin header THT 2x03 1.00mm double row surface-mounted straight pin header, 2x32, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip SMD 1x40 1.27mm single row style2 pin1 right Through hole IDC header, 2x05, 2.54mm pitch, single row 0.8.

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