3
1
Back

Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] With Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.nxp.com/docs/en/package-information/98ASA00525D.pdf), generated with kicad-footprint-generator JST XA series connector.

New Pull Request