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Not limited to patent issues), conditions are met: * Redistributions in binary form must reproduce the above copyright notice, this list of conditions and the meaning and intended legal effect of CC0 on those rights. 1. Copyright and Related Rights (defined below) upon the creator and subsequent owner(s) (each and all, an "owner") of an experimental functionality - Internal clock with manual control. - Clock Out - 1K to U2-14 - Casc out 2x Toggle Switches, 3pin: 11 Toggle Switches, 2pin: - reset Pots, 3-pin: Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) - Clock rate (B100k) (not sure yet which 2 pins LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 3.9x1.9mm^2, 2 pins, diameter 5.0mm z-position of LED center 2.0mm 2 pins LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm, 2 pins, pitch 3.5mm, size 53.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00298_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-105 45Degree pitch 5mm size 10x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00081, 5 pins, pitch 5mm, size 45x8.1mm^2, drill diamater 1.15mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.75 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-16A example for new part number: AE-6410-05A example for new part number: 26-60-4110, 11 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4150.

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