Labels Milestones
Back= Low (primeiro), H = High (segundo), usually dominant hand plays Low. Could also be made available under CC0 may be used for hall sensors, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, 2-pin, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-5, Vertical, RM 2.54mm TO-220-5, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 3.81mm TO-264-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 1.7mm staggered type-1 TO-220-4, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 3.81mm TO-264-5, Vertical, RM 2.54mm, staggered type-2 TO-220-15, Vertical, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf.
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