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Separate entity. Each new version .../Bigger_Push_Switch_Hole_NPTH.kicad_mod | 18 Panels/luther_triangle_vco_quentin_v3.scad | 14 pin DIP socket A-004 4 Knobs Screws, nuts, and spacers (see [build notes](build.md)) | | | | R16, R17, R19, R20 **Potentiometer, 9 mm vertical board mount. Main MK_VCO/Panels/title_test.scad 40 lines default_label_font = "Futura XBlk BT:style=Extra Black") { //} // draw panel, subtract holes // v_wall(h=4, l=height-rail_clearance*2-thickness); // top horizontal rib h_wall(h=1.6, l=right_rib_x); // middle horizontal rib // h_wall(h=4, l=right_rib_x); // one more vertical to mount a circuit board sideways on HP = 5.07; // 5.07 for a single 2.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV, 36.

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