Labels Milestones
BackIpc_gullwing_generator.py TSOP-I, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 461, 4.63x4.15mm, 115 Ball.
- 5505000471ab249f70d985a8f814bce077fb47b2 Mon Sep 17.
- 4.127377e-001 -7.075885e-001 5.735556e-001 facet normal -0.049718 -0.0861137.
- Vertex -5.35022 -5.0946 6.88312.