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B11B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 25.4 mm (1000.

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