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BackLinear_extrude(thickness+1) // text(string, size, halign=halign, font=font); } module shape(hsh, ird, ord, fn4, hg x0= 0; x1 = hsh > 0 ? Ird : ord; x2 = hsh > 0 ? Ord : ird; y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 module knurled_finish(ord, ird, lf, sh, fn, rn) { for(j=[0:rn-1]) assign(h0=sh*j, h1=sh*(j+1/2), h2=sh*(j+1)) { for(i=[0:fn-1]) assign(lf0=lf*i, lf1=lf*(i+1/2), lf2=lf*(i+1)) { polyhedron( points=[ [ 0,0,h0], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf1), ird*sin(lf1), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf1), ird*sin(lf1), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: merged pull request 'pcb_finalization' (#1) from bugfix/10hp into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/4 Put title box in PDF export Merge pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 **Component Count:** 75 0 0 0.
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