Labels Milestones
BackPin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads.
- 5.19155 7.7465 facet normal 0.629653.
- Vertex 5.00013 7.48323 0 vertex -1.98804 9.99456 2.19603.
- 7.62mm; Vertical; threaded flange; footprint includes mount hole.