3
1
Back

Package; 14 leads; body width 6.1 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB locator, 13 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Mounting Hardware.

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