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13x14 raster, 5.537x6.095mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.65mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for the Adafruit Feather M0 Wifi Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 6); middle of panel after deducting left/right sub-panels slider_center = (width_mm - left_panel_width - right_panel_width)/2 + left_panel_width; slider_bottom = v_margin+12; row_2 = row_1 + vertical_space/7; row_3 = working_increment*2 + row_1; // special: the right-hand side tries to squeeze 6 rows into the space of 5 out_working_increment = working_increment * 4 / 5; out_row_2 = out_working_increment*1 + out_row_1; out_row_6 = working_increment*5 + out_row_1; out_row_6 = out_working_increment*5 + out_row_1; out_row_7 = working_increment*6 + out_row_1; out_row_6 = working_increment*5 + out_row_1; From 71d5da41172a5a79b9079ba234cbd61b0c31a525 Mon Sep 17 00:00:00 2001 Subject: [PATCH] AD&D 1e MM, PHB, and DMG used Futura typeface. Delete 'Panels/futura medium condensed bt.ttf' 16055f0ae5 Delete 'Panels/futura medium condensed bt.ttf' Panels/futura medium bt.ttf and /dev/null differ # 2-layer, 1oz copper condition "A.Type == 'pad' && B.Type == 'track'" From f12031bb4117bdc0bfa93734f5e1f978a14297b0 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Use THT electrolytics, finish SMT layout, try on quentin font Schematics/Enlarge/Enlarge.kicad_prl | 10 uF tantalum\nMFOS 1, 1+15 electrolytic\n1 uF tanty looks better than EL\n(higher output, less leakage)\nbut only by a copyright notice and this permission notice appear in all The MIT License (MIT) Copyright (C) 2011-2014 by Jorik Tangelder (Eight Media) Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2016 - present Microsoft Corporation Permission is hereby granted, free of charge, to any person obtaining a copy.

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