Labels Milestones
BackPackage, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 7.62.
- GCT Micro USB B receptacle, Horizontal, through-hole.
- MuRATA, 5200, http://www.murata-ps.com/data/magnetics/kmp_5200.pdf L_CommonMode_Toroid Vertical series Radial.