Labels Milestones
Back2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad.
- 4.9399999999999995mm, distance of mounting holes 63.5mm.
- In Pause CV In.
- Size 55x9mm^2, drill diamater 1.3mm, pad diameter 2.5mm.
- 3.9x1.9mm^2, 2 pins, pitch 7.5mm, size 39.8x14mm^2, drill.
- 46 "B.CrtYd" user "B.Courtyard" 47 "F.CrtYd.