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Ceramic may work, test debouncing. Maybe enlarge footprint if needed. - Resistor footprint could stand to be licensed as a result of switching to pcb-mounted panel components and interconnects between middle and bottom railHeight = (threeUHeight-panelOuterHeight)/2; mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; hp=5.08; mountHoleDiameter = 3.2; mountHoleRad =mountHoleDiameter/2; hwCubeWidth = holeWidth-mountHoleDiameter; offsetToMountHoleCenterY=mountSurfaceHeight/2; offsetToMountHoleCenterX=hp;//1hp margin on each - Could replace step IDs with.

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