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Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas.

• SMD 1218 (3246 Metric), square (rectangular) end.
• 3.939388e-03 -9.991600e-01 vertex -1.066064e+02 9.665134e+01 1.291646e+01 facet normal.

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