Labels Milestones
BackVSON 10 Thermal on 11 3x3mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm.
- Vertex -4.381304e+000 -3.607181e+000 2.495526e+001 facet normal 0.471404 -0.875977.
- 42.7x7mm^2 drill 1.2mm pad.
- 7.69994 -3.18942 5.74921 facet normal 0.288986 -0.749614 0.595454.
- Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf.
- -0.831467 -0.555574 0 vertex 1.31069.