Labels Milestones
Back18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator connector JST ZE series connector, 502494-0470 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 10, Wuerth electronics 9774040951 (https://katalog.we-online.de/em/datasheet/9774040951.pdf), generated with kicad-footprint-generator SMD capacitor, aluminum electrolytic, Vishay 0810, 8.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 6.3x5.8mm SMD capacitor, aluminum electrolytic, Nichicon, 6.3x3.0mm SMD capacitor, aluminum electrolytic, Vishay 1014, 10.0x14.3mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Vishay 1616, 16.0x17.5mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 4.0x3mm SMD capacitor, aluminum electrolytic, Nichicon, 10.0x7.7mm SMD capacitor, aluminum electrolytic, Panasonic C6, 6.3x5.9mm SMD capacitor, aluminum electrolytic nonpolar, 8.0x6.2mm SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 4.0x3.9mm SMD capacitor, aluminum electrolytic nonpolar, 6.3x5.4mm SMD capacitor, aluminum electrolytic, Vishay 1821, 18.0x22.0mm, http://www.vishay.com/docs/28395/150crz.pdf Capacitor SMD Kemet-T (3528-12 Metric), IPC_7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf), generated with kicad-footprint-generator Resistor SMD 1218 (3246 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM12B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 16 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat No Lead Package (ML) - 8x8x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62.
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