Labels Milestones
BackPad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 6.73 mm (264 mils), body size 10.8x6.64mm 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge STN/FSTN LCD 192x64 dot.
- 54mm width 23.8mm Bourns 5700 L_Toroid.
- PTSM-0,5-3-2.5-H-THR, 3 pins, pitch 5.08mm, size 10.2x8.45mm^2, drill.