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---- | ---- | ---- | ---- | ----------- | ---- | ----------- | ---- | | | C1, C11, C12 | 2 Panels/futura medium bt.ttf differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png and /dev/null differ # 2-layer, 1oz copper condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" (condition "A.Net != B.Net" (condition "A.Type == 'via' && B.Type == 'graphic')")) # edge clearance condition "A.Type == 'track'" ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Thu Aug 12 11:11:04 2021 ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes Total unplated holes.

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