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Vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flatpack (PF) .

Header, 1x29, 2.00mm pitch, double.
SM08B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose.
4.308032e-01 9.024458e-01 -3.431192e-04 vertex -1.003011e+02 9.232659e+01.
/arrasta/commit/5ff3077e8252367b7eceb0b21b0803904b695d42">5ff3077e8252367b7eceb0b21b0803904b695d42 0d3d72c49e606725216a5a9a4217e6c039d5a574 Normal 3.562742e-001 -6.107880e-001 7.071116e-001 vertex -2.546318e+000 4.359515e+000.

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