Labels Milestones
BackVery small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 2x33, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole angled pin header THT 2x02 2.00mm double row Through hole straight pin header, 2x15, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x40 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x27 1.00mm single row style2 pin1 right Through hole angled socket strip, 2x30, 1.00mm pitch, double.
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