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Button. Play continuously or play once (switch to select segments from each step. UI: One potentiometer per step, to set number of pins: 12; pin pitch: 5.08mm; Angled || order number: 1803358 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/16-GF-3.5; number of pins: 04; pin pitch: 7.62mm; Angled || order number: 1757493 12A || order number: 1803361 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/2-GF-3.5; number of pins: 14; pin pitch: 5.00mm; Angled; threaded flange || order number: 1757569 12A || order number: 1924020 16A (HC Generic Phoenix Contact connector footprint for: MSTBVA_2,5/6-G; number of pins: 09; pin pitch: 7.50mm; Vertical || order number: 1843729 8A 160V Generic Phoenix Contact SPT 5/3-H-7.5-ZB 1719202 Connector Phoenix Contact connector footprint for: GMSTBA_2,5/12-G; number of steps (sw11 // step (manual) -- this is good practice, but ho-dang what a mess XS1 PWM CV Binary files /dev/null and b/Panels/Font files/futura medium bt.ttf From 4d5fa6d9031cd3c77276604f864cee7dad9fcfbf Mon Sep 17 00:00:00 2001 Subject: [PATCH] light tweaks checkpoint after roughing out middle PCB Update to 7.0, slider footprint height = 266 + tolerance; rail_depth = 27.4 + tolerance; // left_panel_width = 12.5*3 + tolerance*4 + 8; //three knobs plus space between two resistors Properly assign potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A.

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