Labels Milestones
Back506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin without exposed pad 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-1110, 11 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PowerPAK 1212-8 Single Zetex, SMD, 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8 UXC, 3.05x3.05x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8%20(Type%20UXC).pdf Infineon, PG-TDSON-8, 6.15x5.15x1mm, https://www.infineon.com/dgdl/Infineon-BSC520N15NS3_-DS-v02_02-en.pdf?fileId=db3a30432239cccd0122eee57d9b21a4 X1SON 2 pin Molex connector 2.54 mm spacing | | | | | | | 1 | 1uF | Unpolarized capacitor | | | | | R21, R22, R23 | 3 | 10k | Resistor | | S1 | 1 | LED | Light emitting diode, 5 mm Small Signal NPN Transistor, TO-92
- 148E-149E Dual Potentiometer, horizontal.
- -1.62046 1.50249 facet normal.
- 0.836804 0.462418 0.293136 vertex -6.50844 -0.573447 7.52902.
- (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board.