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BackStuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main Merge pull request 'More schematics' (#3) from schematic into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/1 Merge pull request 'Fix rail clearance issues, add PCB slot, more options for potentiometer spoke placement' (#1) from pcb_finalization into main ... Put title box in PDF export' (#4) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 Component Count: 77 Refs 3 pin Molex header | | | | R2, R5 | 1 | 10nF .
- -8.769514e-01 -1.155769e-03 4.805777e-01 facet normal 0.770773 0.0759145.
- A-3486 or A-3487\*\*\* | | .
- (c) 2009, 2010, 2013-2016 by the Derivative.
- Normal 0.638679 -0.741926 0.204047 vertex 5.83811 -4.33969.