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CASE 506CE (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf.

MC_1,5/14-GF-3.81; number of pins.
0.956715 0.0766184 0.280761 facet.
TO-247-5, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2.
Https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die.

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