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3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad.

• Pins LED diameter 5.0mm 3 pins.
• 155.333654 114.75 (end 155.333654.
• -2.646177e-03 9.475776e-01 facet normal 9.369096e-001 5.241795e-003 3.495325e-001.
• 42819-22XX, With thermal vias in.
• -0.821781 -7.28282 7.24568 facet normal 0.0464227 -0.0868543.

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