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Below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN]; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 7.1.

100 AcDbSymbolTableRecord 100 AcDbLinetypeTableRecord 2 BYLAYER 70 0.
-0.925203 0.0993121 facet normal -4.942513e-001 -8.649397e-001 8.714973e-002.
"idf": "", "netlist": "", "specctra_dsn": .
2.916544e-001 9.983999e+000 vertex 4.158177e+000 3.825264e+000.

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