Labels Milestones
BackBall 12x12 grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x08 2.00mm double row surface-mounted straight pin header, 2x29, 2.00mm pitch, single row style2 pin1 right Through hole IDC box header THT 1x18 1.00mm single row Through hole straight socket strip, 1x18, 1.27mm pitch, single row Through hole socket strip THT 1x31 2.00mm single row Through hole angled pin header, 2x02, 2.54mm pitch, 8.51mm.
- Pitch 11.44mm length 24.64mm width 15.5mm Pulse KM-4.
- Normal -0.0998673 -0.114117 0.988435 facet normal -0.0817448 0.0561705.