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506CM (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flatpack No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wire, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0430, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST XA series connector, S12B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, With thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, BM15B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 504050-0491 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Hirose series connector, DF52-8S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/19964.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type086_RT03404HBLC, 4 pins, pitch 3.5mm, size 7.7x7mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10693.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type701_RT11L02HGLU, 2 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic QFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py MPS LGA-18 12x12x3.82mm (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPM3550EGLE/document_id/5102.

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