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5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 5-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm.

0.049276 -0.0860756 0.995069 vertex -8.48002 -4.08376 20.0916 vertex.
Overall 3u height panelOuterHeight =128.5; panelInnerHeight .
MC_1,5/6-G-5.08; number of pins: 06.
Panels/Font files/futura medium bt.ttf // 13 SPDT.

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