3
1
Back

CopperTop Type 1 Gauge, Massstab, 10mm, CopperTop, Type 1, Gauge Massstab 100mm CopperTop Type 1 Gauge, Massstab, 10mm, SilkScreenTop, Type 1, Gauge Massstab 100mm CopperTop Type 1 Gauge, Massstab, 10mm, SilkScreenTop, Type 3, Gauge Massstab 100mm SilkScreenTop Type 1 Gauge, Massstab, 50mm, SilkScreenTop, Type 2, Copper Top, Small, GNU-Logo, GNU-Head, GNU-Kopf, Silkscreen, Symbol, HighVoltage, Type2, Copper Top, Small, Symbol, Creative Commons, CopperTop, Type 1, Gauge Massstab 10mm CopperTop Type 1 Gauge, Massstab, 100mm, Gitter, Grid, CopperTop, Type 3, Gauge Massstab 10mm SilkScreenTop Type 1 Gauge, Massstab, 100mm, CopperTop, Type 2, Copper Top, Small, Waste Electrical and Electronic Equipment Directive Altech AK300 terminal block RND 205-00011, 12 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 5.9 mm (232 mils), body size 10.8x19.34mm 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size.

New Pull Request