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100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD901F-40-00D_Single_Vertical_CircularHoles.kicad_mod create mode 100644 Schematics/Fireball.kicad_sch Subject: [PATCH 15/18] Add jlc constraints DRC; replace order number text Add jlc constraints DRC; replace order number text Add jlc constraints DRC; replace order number text Compare 19 commits » created pull request synth_mages/MK_VCO#5 613d1b6f7e Merge pull request synth_mages/MK_VCO#5 Merge pull request 'More schematics' (#3) from schematic into main ... Add jlc constraints DRC; replace order number text main MK_VCO/Panels/luther_triangle_vco_quentin_v2.scad 302 lines // CV out /* [Default values] */ // Line segments for a single 0.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SUR series connector, 53261-0771 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (www.ti.com/lit/ds/symlink/tps7a7200.pdf#page=36), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-165 , 5 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x12 2.00mm single row style2 pin1 right Through hole angled pin header, 1x14, 1.00mm pitch, double rows Through hole angled pin header THT 2x17 2.00mm double row Through hole angled socket strip, 2x15, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip SMD 1x33 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x31 2.54mm single row Surface mounted pin header THT 1x38 2.54mm single row Surface mounted socket strip THT 1x15 2.00mm single row Surface mounted pin header THT 2x17 2.54mm double row surface-mounted straight pin header, 1x09, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x24 2.00mm single row Surface mounted socket strip THT 2x26 2.54mm double row Through hole straight pin header, 2x18, 1.27mm pitch, double rows Surface mounted pin header SMD 1x19 2.54mm single row style1 pin1 left Surface.

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