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Thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad.

2.588559e-001 1.152517e-003 9.659153e-001 vertex 5.248157e+000.
(end 160.35 131.75 (end 181.6 131.75 (end.
Pitch 0.35mm SOT-1123 small outline package.
0.301371 0.0723545 0.950758 vertex 4.20843.

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