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10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 2x14, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 1.00mm single row Surface mounted pin header THT 1x06 5.08mm single row style1 pin1 left Surface mounted pin header THT 1x28 2.54mm single row Through hole pin header THT 1x22 2.54mm single row style2 pin1 right Through hole straight pin header, 2x33, 2.54mm pitch, double rows Through hole socket strip THT 1x14 2.00mm single row Surface mounted pin header SMD 1x24 1.00mm single row Through hole straight pin header, 2x17, 2.00mm pitch, double rows Surface mounted pin header SMD 1x27 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x33 2.00mm double row Through hole IDC header, 2x06, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x36, 2.54mm pitch, 6mm pin length, single row Through hole straight socket strip, 2x17, 2.54mm pitch, 6mm.

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