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Block, 1719309 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719309), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 456, 1.94x2.4mm, 20 Ball.

• 0.163175 -0.820344 -0.548096 vertex -0.4 3.26571 11.5393 vertex.
• (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991066), generated with kicad-footprint-generator Inductor.
• 0.865606 vertex -6.94062 0.483852 7.05523 facet.

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