Labels Milestones
BackAI Kendryte K210 RISC-V Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 900 1 FF900.
- -1.397735e-01 1.144797e-03 vertex -9.023681e+01 9.809614e+01 1.855000e+01.
- X2QFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf.