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Package (ML) - 8x8x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm SSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1102, With thermal vias in pads, 6 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_6_3.pdf), generated with kicad-footprint-generator JST PUD series connector, B16B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Diode, Universal, SMA (DO-214AC) SMB (DO-214AA) Handsoldering Diode SMF (DO-219AB), http://www.vishay.com/docs/95572/smf_do-219ab.pdf D_SOD-128 (CFP5 SlimSMAW), https://assets.nexperia.com/documents/outline-drawing/SOD128.pdf 8.1x10.5mm, 4A, single phase bridge rectifier case 19x19mm, pitch 12.7mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier, https://www.bourns.com/docs/Product-Datasheets/CD-DF4xxSL.pdf Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89004xx, 4 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 5, Wuerth electronics 9771150360 (https://katalog.we-online.com/em/datasheet/9771150360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm.

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