Labels Milestones

Back

Spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body.

• 7.409530e-001 3.131999e-003 6.715497e-001 facet.
• -0.286108 0.102199 facet normal.
• (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA.
• System, 5267-08A, 8 Pins per row.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects