3
1
Back

Mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils.

New Pull Request