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Values changed\ndue to availability Kassu used 1 µF \npolyester film looks much \nbetter. Low-Power, Quad-Operational Amplifiers, DIP-14/SOIC-14/SSOP-14 Dual Operational Amplifiers, DIP-8/SOIC-8/TO-99-8 | | | R8, R10, R12 | 3 Hardware/Panel/precadsr-panel/fp-lib-table | 4 | 100k | Resistor | | | | | Tayda | A-004 | | R24, R26, R28 | 3 | A1M | Potentiometer | | | J2 | 1 | SW_3PDT_x3 | 3PDT miniature toggle switch - number of pins: 06; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1836367 8A 320V Generic Phoenix Contact connector footprint for: GMSTB_2,5/6-GF-7,62; number of pins: 08; pin pitch: 3.81mm; Angled; threaded flange || order number: 1830729 8A 160V Generic Phoenix Contact SPT 2.5/11-V-5.0-EX 1732580 Connector Phoenix Contact connector footprint for: MSTBVA_2,5/9-G-5,08; number of pins: 08; pin pitch: 3.50mm; Angled || order number: 1847644 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/2-G-5.08; number of pins: 16; pin pitch: 7.50mm; Angled || order number: 1757336 12A || order number: 1829219 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/9-GF-3.5; number of pins: 16; pin pitch: 7.50mm; Angled || order number: 1924033 16A (HC Generic Phoenix Contact SPT 2.5/1-H-5.0 Terminal Block, 1732522 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732522), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a drone / manual version, https://kassu2000.blogspot.com/2018/07/avalance-vco.html for a single 1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body with Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part.

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