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0.8 RS484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x35 1.00mm single row Surface mounted socket strip SMD 1x38 1.00mm single row style2 pin1 right Through hole pin header SMD 1x30 1.00mm single row Through hole pin header THT 2x39 1.27mm double row Through hole angled pin header, 2x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x12 2.54mm double row Through hole pin header THT 1x31 2.54mm single row Surface mounted socket strip THT 1x30 2.00mm single row Through hole horizontal IDC box header THT 1x06 5.08mm single row Through hole angled socket.

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