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3.1, 3.2, 3.3, and 3.4 are conditions of merchantability and fitness for a single 1 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, B14B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105309-xx06, 6 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.25 mm² wire, basic insulation.

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