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1844317 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/10-GF-5.08; number of pins: 11; pin pitch: 3.81mm; Angled; threaded flange || order number: 1803552 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/14-GF-3.81; number of pins: 09; pin pitch: 5.00mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1803358 8A 160V Generic Phoenix Contact SPT 2.5/11-H-5.0 Terminal Block, 1732454 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732454), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-6010, 60 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm.

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