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BackFrom d9153c70802a10d2fe554f80f1a497b409aac630 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Organize Futura Heavy BT.ttf From 750478ab8360c0ef45b55687504a3e4846b752b4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/Panels/MAGIC MISSILE VCF.png | Bin 0 -> 579684 bytes .../Pot_Knobs/pot_knob_two_parts_base.stl | Bin 0 -> 38860 bytes Panels/Font files/futura medium condensed bt.ttf | Bin 0 -> 38764 bytes .../Font files/futura medium bt.ttf From 4d5fa6d9031cd3c77276604f864cee7dad9fcfbf Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add four more switches/buttons, move LED drivers onto PCB added the once through idea with commentary by Correcting changed filename in .prl gets jiggy with PCB locator, 8 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Harting har-flexicon series connector, S06B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0825SA1, 25 Circuits (https://www.molex.com/pdm_docs/sd/2005280250_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 2.5, Wuerth electronics 97730356330 (https://katalog.we-online.com/em/datasheet/97730356330.pdf), generated with kicad-footprint-generator Inductor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP.
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