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File again 8976a63dc0 edits README.md file Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png' abc39a50d6 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/MIRROR IMAGE.png Normal file Unescape Hardware/PCB/precadsr/precadsr.pro Normal file Unescape "Name": "Top Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file View File # For PCBs designed using KiCad: https://www.kicad.org/ # Format documentation: http://kicad-pcb.org/help/file-formats/ # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1.

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