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SOIC, 14 Pin (JEDEC MO-194 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-8DP-2DSA, 4 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires.

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