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DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf), generated with kicad-footprint-generator Molex Pico-Clasp top entry Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-10S-0.5SH, 10 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 39.2x7mm^2, drill diamater 1.2mm, pad diameter 3mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556441-da-01-de-LEITERPLATTENKL__PTSM_0_5__8_2_5_H_THR.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block TE 282834-8 pitch 2.54mm size 23.32x6.5mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00060, 45Degree (cable under 45degree), 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 4.8x2.5mm^2 diameter 2.0mm SMD pad as test point, loop.

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