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DCDC-Converter, 60W POE, Silvertel, pitch 2.54mm, package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5810 single output DCDC-Converter, CINCON, EC6Cxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mgj2.pdf Murata MGJ3, 5.2kVDC Isolated 3W Gate Drive, 15V/5V/5V Configurable, 22.61x23.11x14.19mm, https://power.murata.com/datasheet?/data/power/ncl/kdc_mgj3.pdf Murata NCS1SxxxxSC https://power.murata.com/data/power/ncl/kdc_ncs1.pdf Isolated 1W or 2W Single Output SM DC/DC Converters https://www.murata.com/products/productdata/8807031865374/kdc-nxe1.pdf#page=8 https://www.murata.com/products/productdata/8807031898142/kdc-nxe2.pdf#page=9 Isolated 1W or 2W Single Output SM DC/DC Converters 78sr3.3 78sr5 78sr9 78sr12 78srXX DCDC-Converter, RECOM, RECOM_R-78B-2.0, SIP-3, pitch 2.54mm, size 28.4x6.2mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00276_DB_EN.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix PTSM-0,5-6-2.5-H-THR, 6 pins, pitch 5mm, size 65x9mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-403 45Degree pitch 7.5mm size 60x10.3mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-3-15-5.08 pitch 5.08mm size 30.5x10.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00046, 3 pins, pitch 5mm, size 55x9mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10705.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-303, 45Degree (cable under 45degree), 16 pins, single row Surface mounted pin header THT 1x37 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x02 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header THT 2x07 2.54mm double row surface-mounted straight socket strip, 2x12, 2.54mm pitch, single row Through hole angled pin header THT 1x07 1.27mm single row Through hole straight socket strip, 2x14, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip THT 2x37 1.00mm double row Through hole straight pin header, 2x38, 1.00mm pitch, single row Through hole socket strip SMD 1x17 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x20 1.27mm single row style2 pin1 right Through hole IDC header, 2x20, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x30, 2.54mm pitch, double rows Through hole straight pin header, 1x31, 2.00mm pitch, double rows Surface mounted socket strip THT 2x38 1.00mm double row Through hole straight pin header, 2x36, 2.00mm pitch, single row style2 pin1 right Through hole straight socket strip, 1x36, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 2x35, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout.

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