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FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole IDC header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x28, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x19 1.27mm double row Through hole angled pin header SMD 1x21 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x13 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x18, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x22, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x05 1.27mm double row Through hole angled pin header, 2x25, 2.54mm pitch, single row Through hole socket strip SMD 1x20 2.00mm single row Through hole straight pin header, 2x05, 2.00mm pitch, double rows Through hole IDC header, 2x10, 2.54mm pitch, single row male, vertical entry Harwin LTek Connector, 4 pins, pitch 5mm, size 22.3x14mm^2, drill diamater 1.1mm, pad diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 133, script-generated.

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