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Header, 2x18, 1.27mm pitch, double rows Through hole angled pin header, 2x22, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x02 1.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 1x16 2.54mm single row Through hole angled pin header, 1x23, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x13 2.54mm double row surface-mounted straight socket strip, 2x35, 1.27mm pitch, single row Through hole angled socket strip, 2x16, 1.27mm pitch, 4.4mm socket length, single row Through hole pin header SMD 1x09 2.00mm single row Surface mounted pin header THT 1x07 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x03 1.00mm single row Surface mounted socket strip THT 2x30 2.54mm double row Through hole socket strip SMD 2x13 2.00mm double row surface-mounted straight pin header, 2x38, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC box header THT 1x19 1.00mm single row style2 pin1 right Through hole angled pin header, 2x09, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header SMD 2x21 1.27mm double row Through hole IDC header, 2x17, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9.

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